TOKYO--Elpida Memory, Inc. (Elpida), Japan's leading global supplier of Dynamic Random Access Memory (DRAM), today announced that Elpida has reached a basic agreement with Semiconductor Manufacturing International Corporation (SMIC) and Cension Semiconductor Manufacturing Corporation (Cension) concerning the sale of 200mm wafer processing equipment to Cension. The equipment transferred to Cension will be operated by SMIC.

Elpida is committed to the development, production and sales of advanced DRAMs. Our goal is to provide the most advanced process technology and even higher speed and lower power consumption DRAMs.

For this reason, Elpida has concluded that it is important for Hiroshima Elpida Memory, Inc. (Hiroshima Elpida) to sell its 200mm wafer processing equipment in order to devote Elpida's resources to quickly achieving a 300mm line that uses advanced production processes. Thus, as part of this increase in our 300mm line manufacturing capabilities, we have decided to transfer Hiroshima Elpida's 200mm equipment to Cension.

Also, Elpida expects that the Hiroshima Elpida's 200mm equipment will be used more efficiently by SMIC, and we have intention to continue to provide support to customers who have placed orders for production of 200mm wafer line products.